CEN/TC 121
| Project No. | EN 29453:1993 |
|---|---|
| Title | This standard specifies requirements for chemical composition for the following families of soft solder alloys, tin-lead, with and without antimony; tin silver, with and without lead; tin-copper, with and without lead; tin-antimony; tin-lead-bismuth; bismuth-tin; tin-lead-cadmium; tin-indium; and lead-silver, with and without tin. |
| Registration number (WIID) | 3194 |
| Scope | This standard specifies requirements for chemical composition for the following families of soft solder alloys, tin-lead, with and without antimony; tin silver, with and without lead; tin-copper, with and without lead; tin-antimony; tin-lead-bismuth; bismuth-tin; tin-lead-cadmium; tin-indium; and lead-silver, with and without tin. |
| Status | Atcelts |
| ICS group | 25.160.50 |