Project No.ISO 9453:2014
Title<p>ISO 9453:2014 specifies the requirements for chemical composition for soft solder alloys containing two or more of tin, lead, antimony, copper, silver, bismuth, zinc, indium and/or cadmium.</p>
Registration number (WIID)59299
Scope<p>ISO 9453:2014 specifies the requirements for chemical composition for soft solder alloys containing two or more of tin, lead, antimony, copper, silver, bismuth, zinc, indium and/or cadmium.</p>
StatusAtcelts
ICS group25.160.50