<p>ISO 9453:2006 specifies the requirements for chemical composition for the following families of soft solder alloys:</p>
<ul><li>tin-lead, with and without antimony, bismuth, cadmium, copper, and silver;</li><li>tin-antimony;</li><li>tin-bismuth;</li><li>tin-copper, with and without silver;</li><li>tin-indium, with and without silver and bismuth;</li><li>tin-silver, with and without copper and bismuth;</li><li>tin-zinc, with and without bismuth.</li></ul>
<p>ISO 9453:2006 also includes an indication of the forms generally available.</p>
Registration number (WIID)
41923
Scope
<p>ISO 9453:2006 specifies the requirements for chemical composition for the following families of soft solder alloys:</p>
<ul><li>tin-lead, with and without antimony, bismuth, cadmium, copper, and silver;</li><li>tin-antimony;</li><li>tin-bismuth;</li><li>tin-copper, with and without silver;</li><li>tin-indium, with and without silver and bismuth;</li><li>tin-silver, with and without copper and bismuth;</li><li>tin-zinc, with and without bismuth.</li></ul>
<p>ISO 9453:2006 also includes an indication of the forms generally available.</p>
