Project No.ISO 9453:2020
Title<p>This document specifies the requirements for chemical composition for soft solder alloys containing two or more of: tin, lead, antimony, copper, silver, bismuth, zinc, indium and/or cadmium.</p> <p>An indication of the forms generally available is also included.</p>
Registration number (WIID)78822
Scope<p>This document specifies the requirements for chemical composition for soft solder alloys containing two or more of: tin, lead, antimony, copper, silver, bismuth, zinc, indium and/or cadmium.</p> <p>An indication of the forms generally available is also included.</p>
StatusStandarts spēkā
ICS group25.160.50