Registration number (WIID)Project No.TitleStatus
41923ISO 9453:2006Soft solder alloys — Chemical compositions and formsAtcelts
17168ISO 9455-1:1990Soft soldering fluxes — Test methods — Part 1: Determination of non-volatile matter, gravimetric methodAtcelts
17172ISO 9455-5:1992Soft soldering fluxes — Test methods — Part 5: Copper mirror testAtcelts
54323ISO 9455-16:2013Soft soldering fluxes — Test methods — Part 16: Flux efficacy test, wetting balance methodAtcelts
2394ISO 9455-15:1996Soft soldering fluxes — Test methods — Part 15: Copper corrosion testAtcelts
81065ISO/AWI 9455-2Soft soldering fluxes — Test methods — Part 2: Determination of non-volatile matter, ebulliometric methodStandarts spēkā
78822ISO 9453:2020Soft solder alloys — Chemical compositions and formsStandarts spēkā
69292ISO 9455-14:2017Soft soldering fluxes — Test methods — Part 14: Assessment of tackiness of flux residuesStandarts spēkā
69290ISO 9455-11:2017Soft soldering fluxes — Test methods — Part 11: Solubility of flux residuesStandarts spēkā
81064ISO 9455-5:2020Soft soldering fluxes — Test methods — Part 5: Copper mirror testStandarts spēkā
Displaying 41-50 of 66 results.