25.160.50 Brazing and soldering

Soft soldering fluxes - Test methods - Part 14: Assessment of tackiness of flux residues

Soft soldering fluxes - Test methods - Part 5: Copper mirror test

Soft soldering fluxes - Test methods - Part 8: Determination of zinc content

Attachment materials for electronic assembly - Part 1-1: Requirements for soldering fluxes for high-quality interconnections in electronics assembly

Attachment materials for electronic assembly - Part 1-2: Requirements for solder pastes for high-quality interconnections in electronics assembly

Requirements for solder pastes for high-quality interconnections in electronics assembly

Attachment materials for electronic assembly - Part 1-3: Requirements for electronic grade solder alloys and fluxed and non-fluxed solid solders for electronic soldering applications

Attachment materials for electronic assembly - Part 1-3: Requirements for electronic grade solder alloys and fluxed and non-fluxed solid solders for electronic soldering applications