Search
step 1 - search
2
step 2 - choose
3
step 3 - settings
4
step 4 - order
5
step 5 - pay
Displaying 22729-22740 of 28786 results. Export to excel
LVS EN 60169-25:2002
standard
EN
Radio-frequency connectors - Part 25: Two-pole screw (3/4-20 UNEF) coupled connectors for use with shielded balanced cables having twin inner conductors with inner diameter of outer conductor 13,56 mm (0, 534 in) (type TWHN)
8.81 €
LVS EN IEC 60172:2021
standard
EN
Test procedure for the determination of the temperature index of enamelled and tape wrapped winding wires
18.53 €
LVS EN 60188:2002
standard
EN
High pressure mercury vapour lamps - Performance specifications
22.17 €
LVS EN 60188:2002/A11:2019
amendment
EN
High-pressure mercury vapour lamps - Performance specifications
12.14 €
LVS EN 60191-3:2002
standard
EN
Mechanical standardization of semiconductor devices - Part 3: General rules for the preparation of outline drawings of integrated circuits
24.60 €
LVS EN 60191-4:2014
standard
EN
Mechanical standardization of semiconductor devices - Part 4: Coding system and classification into forms of package outlines for semiconductor device packages (IEC 60191-4:2013)
17.61 €
LVS EN 60191-4:2014/A1:2018
amendment
EN
Mechanical standardization of semiconductor devices - Part 4: Coding system and classification into forms of package outlines for semiconductor device packages
13.97 €
LVS EN 60191-6-10:2004
standard
EN
Mechanical standardization of semiconductor devices - Part 6-10: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Dimensions of P-VSON
13.05 €
LVS EN 60191-6-1:2002
standard
EN
Mechanical standardization of semiconductor devices - Part 6-1: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for gull- wing lead terminals
11.25 €
LVS EN 60191-6-12:2011
standard
EN
Mechanical standardization of semiconductor devices - Part 6-12: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guidelines for fine-pitch land grid array (FLGA)IEC 60191-6-12:2011)
16.40 €
LVS EN 60191-6-13:2017
standard
EN
Mechanical standardization of semiconductor devices - Part 6-13: Design guideline of open-top-type sockets for Fine-pitch Ball Grid Array (FBGA) and Fine-pitch Land Grid Array (FLGA)
16.40 €
LVS EN 60191-6-16:2007
standard
EN
Mechanical standardization of semiconductor devices - Part 6-16: Glossary of semiconductor tests and burn-in sockets for BGA, LGA, FBGA and FLGA
12.14 €