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Circuit boards and circuit board assemblies - Design and use - Part 6-3: Land pattern design - Description of land pattern for through hole components (THT)

Printed boards and printed board assemblies - Design and use - Part 6-4: Land pattern design - Generic requirements for dimensional drawings of surface mounted components (SMD) from the viewpoint of land pattern design

Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 11: Measurement of melting temperature or melting temperature ranges of solder alloys (IEC 61189-11:2013)

Test methods for electrical materials, interconnection structures and assemblies - Part 1: General test methods and methodology

Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 2: Test methods for materials for interconnection structures

Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 2-719: Test methods for materials for interconnection structures - Relative permittivity and loss tangent (500 MHz to 10 GHz)

Testa metodes elektromateriāliem, shēmplatēm un citām starpsavienojumu struktūrām un montāžas mezgliem. 2-721.daļa: Testa metodes starpsavienojumu struktūru materiāliem. Ar varu pārklāta lamināta relatīvās dielektriskās caurlaidības un dielektrisko zudumu leņķa tangensa noteikšana mikroviļņu diapazonā, lietojot telpisko dielektrisko rezonatoru (IEC 61189-2-721:2015)

Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 3: Test methods for interconnection structures (printed boards)

Testa metodes elektromateriāliem, shēmplatēm un citām starpsavienojumu struktūrām un montāžas mezgliem. 3-719.daļa: Testa metodes starpsavienojumu struktūru materiāliem (shēmplatēm). Vienpusēju shēmplašu ar metalizētiem montāžas urbumiem pretestības izmaiņas pārraudzīšana temperatūras ciklēšanas laikā (IEC 61189-3-719:2016)

Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-1: General test methods for materials and assemblies - Guidance for printed board assemblies

Test methods for electrical materials, interconnection structures and assemblies - Part 5: Test methods for printed board assemblies

Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-2: General test methods for materials and assemblies - Soldering flux for printed board assemblies