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Displaying 26977-26988 of 28802 results. Export to excel
LVS EN 62044-1:2002
standard
EN
Cores made of soft magnetic materials - Measuring methods - Part 1: Generic specification
10.02 €
LVS EN 62044-2:2005
standard
EN
Cores made of soft magnetic materials - Measuring methods - Part 2: Magnetic properties at low excitation level
20.34 €
LVS EN 62044-2:2005/AC:2021
corrigendum
EN
Cores made of soft magnetic materials - Measuring methods - Part 2: Magnetic properties at low excitation level
0.00 €
LVS EN IEC 62044-3:2023
standard
EN
Cores made of soft magnetic materials - Measuring methods - Part 3: Magnetic properties at high excitation level
24.60 €
LVS EN IEC 62046:2018
standard
EN
Safety of machinery - Application of protective equipment to detect the presence of persons
29.76 €
LVS EN 62047-10:2012
standard
EN
Semiconductor devices - Micro-electromechanical devices - Part 10: Micro-pillar compression test for MEMS materials (IEC 62047-10:2011)
12.14 €
LVS EN 62047-11:2014
standard
EN
Semiconductor devices - Micro-electromechanical devices - Part 11: Test method for coefficients of linear thermal expansion of free-standing materials for micro-electromechanical systems (IEC 62047-11:2013)
16.40 €
LVS EN 62047-1:2016
standard
EN
Semiconductor devices - Micro-electromechanical devices - Part 1: Terms and definitions
20.34 €
LVS EN 62047-12:2012
standard
EN
Semiconductor devices - Micro-electromechanical devices - Part 12: Bending fatigue testing method of thin film materials using resonant vibration of MEMS structures (IEC 62047-12:2011)
19.44 €
LVS EN 62047-13:2012
standard
EN
Semiconductor devices - Micro-electromechanical devices - Part 13: Bend- and shear- type test methods of measuring adhesive strength for MEMS structures (IEC 62047-13:2012)
13.97 €
LVS EN 62047-14:2012
standard
EN
Semiconductor devices - Micro-electromechanical devices - Part 14: Forming limit measuring method of metallic film materials (IEC 62047-14:2012)
14.87 €
LVS EN 62047-16:2015
standard
EN
Semiconductor devices - Micro-electromechanical devices - Part 16: Test methods for determining residual stresses of MEMS films – Wafer curvature and cantilever beam deflection methods
13.05 €