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Materials for printed boards and other interconnecting structures - Part 4-17: Sectional specification set for prepreg materials, unclad (for the manufacture of multilayer boards) - Multifunctional non-halogenated epoxide woven E-glass prepreg of defined flammability (vertical burning test) for lead-free assembly (IEC 61249-4-17:2009)

Materials for printed boards and other interconnecting structures - Part 4-18: Sectional specification set for prepreg materials, unclad (for the manufacture of multilayer boards) - High performance epoxide woven E-glass prepreg of defined flammability (vertical burning test) for lead-free assembly

Materials for printed boards and other interconnecting structures - Part 4-19: Sectional specification set for prepreg materials, unclad (for the manufacture of multilayer boards) - High performance non-halogenated epoxide woven E-glass prepreg of defined flammability (vertical burning test) for lead-free assembly (IEC 61249-4-19:2013)

Materials for printed boards and other interconnecting structures - Part 4-2: Sectional specification set for prepreg materials, unclad - Multifunctional epoxide woven E-glass prepreg of defined flammability

Materials for printed boards and other interconnecting structures - Part 4-5: Sectional specification for prepreg materials, unclad - Polyimide, modified or unmodified, woven E-glass prepreg of defined flammability

Materials for interconnection structures - Part 5: Sectional specification set for conductive foils and films with and without coatings - Section 1: Copper foils (for the manufacturer of copper-clad base materials)

Materials for interconnection structures - Part 5: Sectional specification set for conductive foils and films with or without coatings - Section 4: Conductive inks

Materials for interconnection structures - Part 7: Sectional specification set for restraining core materials - Section 1: Copper/Invar/copper

Materials for interconnection structures - Part 8: Sectional specification set for non-conductive films and coatings - Section 7: Marking legend inks

Materials for interconnection structures - Part 8: Sectional specification set for non-conductive films and coatings - Section 8: Temporary polymer coatings

Shēmplašu un citu shēmojumu materiāli. 2-45.daļa: Plakēti un neplakēti stiegrotie pamatnes materiāli. Ar nesaaustām vai saaustām E-stikla šķiedrām stiegrots, ar siltumvadītspēju 1,0 W/m•K un normētu uzliesmojamību (vertikālās degšanas tests), ar varu plakēts nehalogenētu epoksīdsveķu lamināts bezsvina aprīkojumam (IEC 61249-2-45:2018)

Shēmplašu un citu shēmojumu materiāli. 2-46.daļa: Plakēti un neplakēti stiegrotie pamatnes materiāli. Ar nesaaustām vai saaustām E-stikla šķiedrām stiegrots, ar siltumvadītspēju 1,5 W/m•K un normētu uzliesmojamību (vertikālās degšanas tests), ar varu plakēts nehalogenētu epoksīdsveķu lamināts bezsvina aprīkojumam (IEC 61249-2-46:2018)