31.190 Electronic component assemblies

Environmental testing - Part 2-82: Tests - Test Xw1: Whisker test methods for components and parts used in electronic assemblies

Environmental testing - Part 2-83: Tests - Test Tf: Solderability testing of electronic components for surface mounting devices (SMD) by the wetting balance method using solder paste

Printed board design, manufacture and assembly - Terms and definitions

Mechanical structures for electronic equipment - Dimensions of mechanical structures of the 482,6 mm (19 in) series - Part 4: Subracks and associated plug-in units - Additional dimensions

Modular order for the development of mechanical structures for electronic equipment practices - Part 2: Sectional specification - Interface co-ordination dimensions for the 25 mm equipment practice - Section 1: Detail specification - Dimensions for cabinets and racks

Modular order for the development of mechanical structures for electronic equipment practices - Part 2: Sectional specification - Interface co-ordination dimensions for the 25 mm equipment practice

Modular order for the development of mechanical structures for electronic equipment practices - Part 2: Sectional specification - Interface co-ordination dimensions for the 25 mm equipment practice - Section 2: Detail specification - Dimensions for subracks, chassis, backplanes, front panels and plug-in units

Complete filter units for radio interference suppression - Part 2-1: Blank detail specification: Passive filter units for electromagnetic interference suppression - Filters for which safety tests are required (assessment level D/DZ)

Complete filter units for radio interference suppression - Part 2-2: Blank detail specification - Passive filter units for electromagnetic interference suppression - Filters for which safety tests are required (Safety tests only)

Reliability stress screening - Part 1: Repairable assemblies manufactured in lots

Printed boards and printed board assemblies - Design and use - Part 1-1: Generic requirements - Flatness considerations for electronic assemblies

Printed boards and printed board assemblies - Design and use - Part 1-2: Generic requirements - Controlled impedance