31.190 Electronic component assemblies

Device embedding assembly technology - Part 1: Generic specification for device embedded substrates

Device embedding assembly technology - Part 2-5: Guidelines - Implementation of a 3D data format for device embedded substrate

Device embedding assembly technology - Part 2-602: Guideline for stacked electronic module - Evaluation method of inter-module electrical connectivity

Endurance test methods for die attach materials - Part 2: Temperature cycling test method for die attach materials applied to discrete type power electronic devices

Generic specification: Modular electronic units

Sectional specification: Microwave modular electronic units of assessed quality - Part 1: Capability approval procedure

Sectional specification: Microwave modular electronic units of assessed quality - Part 2: Index of test methods

Blank detail specification: Microwave modular elektronic units of assessed quality - Capability approval