31.180 Printed circuits and boards

Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 2: Test methods for materials for interconnection structures

Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 2-719: Test methods for materials for interconnection structures - Relative permittivity and loss tangent (500 MHz to 10 GHz)

Testa metodes elektromateriāliem, shēmplatēm un citām starpsavienojumu struktūrām un montāžas mezgliem. 2-721.daļa: Testa metodes starpsavienojumu struktūru materiāliem. Ar varu pārklāta lamināta relatīvās dielektriskās caurlaidības un dielektrisko zudumu leņķa tangensa noteikšana mikroviļņu diapazonā, lietojot telpisko dielektrisko rezonatoru (IEC 61189-2-721:2015)

Test methods for electrical materials, interconnection structures and assemblies - Part 3: Test methods for interconnection structures (printed boards)

Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 3: Test methods for interconnection structures (printed boards)

Testa metodes elektromateriāliem, shēmplatēm un citām starpsavienojumu struktūrām un montāžas mezgliem. 3-719.daļa: Testa metodes starpsavienojumu struktūru materiāliem (shēmplatēm). Vienpusēju shēmplašu ar metalizētiem montāžas urbumiem pretestības izmaiņas pārraudzīšana temperatūras ciklēšanas laikā (IEC 61189-3-719:2016)

Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-1: General test methods for materials and assemblies - Guidance for printed board assemblies

Test methods for electrical materials, interconnection structures and assemblies - Part 5: Test methods for printed board assemblies

Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-2: General test methods for materials and assemblies - Soldering flux for printed board assemblies

Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-3: General test methods for materials and assemblies - Soldering paste for printed board assemblies

Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-4: General test methods for materials and assemblies - Solder alloys and fluxed and non-fluxed solid wire for printed board assemblies

Test methods for electrical materials, printed board and other interconnection structures and assemblies - Part 5-503: General test method for materials and assemblies - Conductive anodic filaments (CAF) testing of circuit boards