31.180 Printed circuits and boards

Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-501: General test methods for materials and assemblies - Surface insulation resistance (SIR) testing of solder fluxes

Test methods for electrical materials, printed board and other interconnection structures and assemblies - Part 5-502: General test methods for materials and assemblies - Surface insulation resistance (SIR) testing of assemblies

Test methods for electrical materials, printed board and other interconnection structures and assemblies - Part 5-504: General test methods for materials and assemblies - Process ionic contamination testing (PICT)

Testa metodes elektromateriāliem, drukātās shēmas platēm un citām starpsavienojumu struktūrām un montāžas mezgliem. 5-601.daļa: Vispārīgās testa metodes materiāliem un montāžas mezgliem. Lodētu savienojumu piemērotības pārbaude lodēšanai ar kausēšanu un drukātās shēmas plašu karstumizturības pārbaude lodējot (IEC 61189-5-601:2021)

Printed board assemblies - Part 1: Generic specification - Requirements for soldered electrical and electronic assemblies using surface mount and related assembly technologies

Printed board assemblies - Part 2: Sectional specification: Requirements for surface mount soldered assemblies

Printed board assemblies - Part 3: Sectional specification - Requirements for through-hole mount soldered assemblies

Printed board assemblies - Part 4: Sectional specification - Requirements for terminal soldered assemblies

Printed board assemblies - Part 6: Evaluation criteria for voids in soldered joints of BGA and LGA and measurement method (IEC 61191-6:2010)

Quality assessment systems - Part 1: Registration and analysis of defects on printed board assemblies

Materials for printed boards and other interconnecting structures - Part 2-10: Reinforced base materials, clad and unclad - Cyanate ester, brominated epoxide modified or unmodified woven E-glass reinforced laminate sheets of defined flammability (vertical burning test), copper-clad

Materials for printed boards and other interconnecting structures - Part 2-10: Reinforced base materials, clad and unclad; Cyanate ester, brominated epoxide modified or unmodified woven E-glass reinforced laminated sheets of defined flammability (vertical burning test), copper-clad