31.180 Printed circuits and boards

Materials for printed boards and other interconnecting structures - Part 2-27: Reinforced base materials clad and unclad - Bismaleimide/triazine modified with non-halogenated epoxide woven glass laminate sheets of defined flammability (vertical burning test), copper-clad (IEC 61249-2-27:2012)

Materials for printed boards and other interconnecting structures - Part 2-30: Reinforced base materials clad and unclad - Non-halogenated epoxide modified cyanate ester woven glass laminate of defined flammability (vertical burning test), copper-clad (IEC 61249-2-30:2012)

Materials for printed boards and other interconnecting structures -- Part 2-35: Reinforced base materials, clad and unclad - Modified epoxide woven E-glass laminate sheets of defined flammability (vertical burning test), copper-clad for lead-free (IEC 61249-2-35:2008)assembly

Materials for printed boards and other interconnecting structures -- Part 2-36: Reinforced base materials, clad and unclad - Epoxide woven E-glass laminate sheets of defined flammability (vertical burning test), copper-clad for lead-free assembly (IEC 61249-2-36:2008)

Materials for printed boards and other interconnecting structures -- Part 2-37: Reinforced base materials, clad and unclad - Modified non-halogenated epoxide woven E-glass laminate sheets of defined flammability (vertical burning test), copper-clad for lead-free assembly (IEC 61249-2-37:2008)

Materials for printed boards and other interconnecting structures -- Part 2-38: Reinforced base materials, clad and unclad - Non-halogenated epoxide woven E-glass laminate sheets of defined flammability (vertical burning test), copper-clad for lead-free assembly (IEC 61249-2-38:2008)

Materials for printed boards and other interconnecting structures - Part 2-39: Reinforced base materials clad and unclad - High performance epoxide and non-epoxide, woven E-glass laminate sheets of defined flammability (vertical burning test), copper-clad for lead-free assembly (IEC 61249-2-39:2012)

Materials for printed boards and other interconnecting structures - Part 2-40: Reinforced base materials clad and unclad - High performance, non-halogenated epoxide woven E-glass laminate sheets of defined flammability (vertical burning test), copper-clad for lead-free assembly (IEC 61249-2-40:2012)

Materials for printed boards and other interconnecting structures - Part 2-41: Reinforced base materials clad and unclad - Brominated epoxide cellulose paper/woven E-glass reinforced laminate sheets of defined flammability (vertical burning test), copper-clad for lead-free assembly (IEC 61249-2-41:2010)

Materials for printed boards and other interconnecting structures - Part 2-4: Reinforced base materials, clad and unclad - Polyester non-woven/woven fiberglass laminated sheet of defined flammability (vertical burning test), copper-clad

Materials for printed boards and other interconnecting structures - Part 2-42: Reinforced base materials clad and unclad - Brominated epoxide non-woven / woven E-glass reinforced laminate sheets of defined flammability (vertical burning test), copper-clad for lead-free assembly (IEC 61249-2-42:2010)

Shēmplašu un citu shēmojumu materiāli. 2-43.daļa: Plakēti un neplakēti stiegrotie pamatnes materiāli. Ar celulozes papīra vai saaustām E-stikla šķiedrām stiegrots, ar normētu uzliesmojamību (vertikālās degšanas tests), ar varu plakēts nehalogenētu epoksīdsveķu lamināts bezsvina aprīkojumam (IEC 61249-2-43:2016)