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LVS EN IEC 61189-2-720:2024
standard
EN
Test methods for electrical materials, circuit boards and other interconnection structures and assemblies - Part 2-720: Detection of defects in interconnection structures by measurement of capacitance
12.14 €
LVS EN IEC 61189-2-801:2023
standard
EN
Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 2-801: Thermal conductivity test for base materials
12.14 €
LVS EN IEC 61189-2-803:2023
standard
EN
Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 2-803: Test methods for Z-axis expansion of base materials and printed boards
11.25 €
LVS EN IEC 61189-2-804:2023
standard
EN
Test methods for electrical materials, printed board and other interconnection structures and assemblies - Part 2-804: Test methods for time to delamination - T260, T288, T300
11.25 €
LVS EN IEC 61189-2-805:2024
standard
EN
Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 2-805: X/Y CTE test for thin base materials by TMA
12.14 €
LVS EN IEC 61189-2-807:2022
standard
EN
Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 2-807: Test methods for materials for interconnection structures - Decomposition temperature (Td) using TGA
11.25 €
LVS EN IEC 61189-2-808:2024
standard
EN
Test methods for electrical materials, printed board and other interconnection structures and assemblies - Part 2-808: Thermal resistance of an assembly by thermal transient method
17.61 €
LVS EN IEC 61189-2-809:2025
standard
EN
Test methods for electrical materials, circuit boards and other interconnection structures and assemblies - Part 2-809: X/Y coefficient of thermal expansion (CTE) test for thick base materials by TMA
12.14 €
LVS EN IEC 61189-3-302:2026
standard
EN
Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 3-302: Detection of plating defects in unpopulated circuit boards by computed tomography (CT)
16.40 €
LVS EN IEC 61189-5-301:2021
standard
EN
Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-301: General test methods for materials and assemblies - Soldering paste using fine solder particles
21.25 €
LVS EN IEC 61189-5-501:2021
standard
EN
Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-501: General test methods for materials and assemblies - Surface insulation resistance (SIR) testing of solder fluxes
17.61 €
LVS EN IEC 61189-5-502:2021
standard
EN
Test methods for electrical materials, printed board and other interconnection structures and assemblies - Part 5-502: General test methods for materials and assemblies - Surface insulation resistance (SIR) testing of assemblies
17.61 €