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Test methods for electrical materials, printed board and other interconnection structures and assemblies - Part 5-504: General test methods for materials and assemblies - Process ionic contamination testing (PICT)

Testa metodes elektromateriāliem, drukātās shēmas platēm un citām starpsavienojumu struktūrām un montāžas mezgliem. 5-601.daļa: Vispārīgās testa metodes materiāliem un montāžas mezgliem. Lodētu savienojumu piemērotības pārbaude lodēšanai ar kausēšanu un drukātās shēmas plašu karstumizturības pārbaude lodējot (IEC 61189-5-601:2021)

Attachment materials for electronic assembly - Part 1-1: Requirements for soldering fluxes for high-quality interconnections in electronics assembly

Attachment materials for electronic assembly - Part 1-2: Requirements for soldering pastes for high-quality interconnects in electronics assembly

Attachment materials for electronic assembly - Part 1-3: Requirements for electronic grade solder alloys and fluxed and non-fluxed solid solder for electronic soldering applications

Printed board assemblies - Part 2: Sectional specification - Requirements for surface mount soldered assemblies

Printed board assemblies - Part 2: Sectional specification - Requirements for surface mount soldered assemblies

Printed board assemblies - Part 3: Sectional specification - Requirements for through-hole mount soldered assemblies

Printed board assemblies - Part 4: Sectional specification - Requirements for terminal soldered assemblies

Printed board assemblies - Part 6: Evaluation criteria for voids in soldered joints of BGA and LGA and measurement method (IEC 61191-6:2010)

Printed board assemblies - Part 1: Generic specification - Requirements for soldered electrical and electronic assemblies using surface mount and related assembly technologies

Quality assessment systems - Part 1: Registration and analysis of defects on printed board assemblies