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IEC 60684-3-281:2010 gives the requirements for two types of heat-shrinkable, polyolefin sleeving, semiconductive, with a nominal shrink ratio of 3:1. This sleeving has been found suitable up to temperatures of 100 °C. - Type A: Thin wall - Internal diameter up to 195,0 mm typically; - Type B: Medium wall - Internal diameter up to 120,0 mm typically
Reģistrācijas numurs (WIID)
53278
Darbības sfēra
IEC 60684-3-281:2010 gives the requirements for two types of heat-shrinkable, polyolefin sleeving, semiconductive, with a nominal shrink ratio of 3:1. This sleeving has been found suitable up to temperatures of 100 °C. - Type A: Thin wall - Internal diameter up to 195,0 mm typically; - Type B: Medium wall - Internal diameter up to 120,0 mm typically
