CLC/SR 91
| Projekta Nr. | EN 60068-2-58:1999 |
|---|---|
| Nosaukums | Provides standard procedures for determining the solderability, resistance to dissolution of metallization and resistance to soldering heat of surface mounting devices. The procedures use either a solder bath or reflow method and are applicable only to specimens or products designed to withstand short term immersion in molten solder or limited exposure to reflow system. |
| Reģistrācijas numurs (WIID) | 44997 |
| Darbības sfēra | Provides standard procedures for determining the solderability, resistance to dissolution of metallization and resistance to soldering heat of surface mounting devices. The procedures use either a solder bath or reflow method and are applicable only to specimens or products designed to withstand short term immersion in molten solder or limited exposure to reflow system. |
| Statuss | Atcelts |
| ICS grupa | 19.040 31.190 |