CLC/SR 91
| Projekta Nr. | EN IEC 61188-6-1:2021 |
|---|---|
| Nosaukums | IEC 61188-6-1:2021 specifies the requirements for soldering surfaces on circuit boards. This includes lands and land pattern for surface mounted components and also solderable hole configurations for through-hole mounted components. These requirements are based on the solder joint requirements of the IEC 61191-1, IEC 61191-2, IEC 61191-3 and IEC 61191-4. |
| Reģistrācijas numurs (WIID) | 68807 |
| Darbības sfēra | IEC 61188-6-1:2021 specifies the requirements for soldering surfaces on circuit boards. This includes lands and land pattern for surface mounted components and also solderable hole configurations for through-hole mounted components. These requirements are based on the solder joint requirements of the IEC 61191-1, IEC 61191-2, IEC 61191-3 and IEC 61191-4. |
| Statuss | Izstrādē |
| ICS grupa | 31.180 31.190 |