CLC/SR 40
| Projekta Nr. | EN IEC 60286-3:2022 |
|---|---|
| Nosaukums | This part of IEC 60286 is applicable to the tape packaging of electronic components without leads or with lead stumps, intended to be connected to electronic circuits. It includes only those dimensions that are essential for the taping of components intended for the above-mentioned purposes. This document also includes requirements related to the packaging of singulated die products including bare die and bumped die (flip chips). |
| Reģistrācijas numurs (WIID) | 73961 |
| Darbības sfēra | This part of IEC 60286 is applicable to the tape packaging of electronic components without leads or with lead stumps, intended to be connected to electronic circuits. It includes only those dimensions that are essential for the taping of components intended for the above-mentioned purposes. This document also includes requirements related to the packaging of singulated die products including bare die and bumped die (flip chips). |
| Statuss | Standarts spēkā |
| ICS grupa | 31.020 31.240 |