Projekta Nr.EN ISO 9453:2014
NosaukumsISO 9453:2014 specifies the requirements for chemical composition for soft solder alloys containing two or more of tin, lead, antimony, copper, silver, bismuth, zinc, indium and/or cadmium.
Reģistrācijas numurs (WIID)36537
Darbības sfēraISO 9453:2014 specifies the requirements for chemical composition for soft solder alloys containing two or more of tin, lead, antimony, copper, silver, bismuth, zinc, indium and/or cadmium.
StatussAtcelts
ICS grupa25.160.50