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<p>ISO 9455-14:2017 specifies a qualitative method for the assessment of the tackiness of the residues of a soft soldering flux after a soldering process. The method is applicable to all fluxes, solder pastes and flux cored solder wires. The method is particularly appropriate for applications where flux residues are left <i>in situ</i> on electrical and electronic equipment.</p>
Reģistrācijas numurs (WIID)
69292
Darbības sfēra
<p>ISO 9455-14:2017 specifies a qualitative method for the assessment of the tackiness of the residues of a soft soldering flux after a soldering process. The method is applicable to all fluxes, solder pastes and flux cored solder wires. The method is particularly appropriate for applications where flux residues are left <i>in situ</i> on electrical and electronic equipment.</p>
