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<p>This document specifies the requirements for chemical composition for soft solder alloys containing two or more of: tin, lead, antimony, copper, silver, bismuth, zinc, indium and/or cadmium.</p>
<p>An indication of the forms generally available is also included.</p>
Reģistrācijas numurs (WIID)
78822
Darbības sfēra
<p>This document specifies the requirements for chemical composition for soft solder alloys containing two or more of: tin, lead, antimony, copper, silver, bismuth, zinc, indium and/or cadmium.</p>
<p>An indication of the forms generally available is also included.</p>
