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This International Standard describes a method for measuring adhesion strength between micro-pattern and substrates by scratching with a wedged-shape diamond stylus, since traditional adhesion test has the limitation that it is difficult to evaluate the adhesion of fine pattern coatings with a width less than several millimeters.
During the test, either a constant or progressive force normal to the surface is applied to the stylus. This yields adhesive and/or cohesive failures of the pattern coating-substrate system.
This test method is suitable for evaluating fine copper circuits up to a width of tens of micrometers and might also be suitable for evaluating fine patterns of other widths and materials. This international standard is intended for use in the macro (0,1 N to 30 N) force range. This procedure may also be applicable to other force ranges. However, appropriate calibration is required to quantify the normal forces at which failures occur.
Reģistrācijas numurs (WIID)
84254
Darbības sfēra
This International Standard describes a method for measuring adhesion strength between micro-pattern and substrates by scratching with a wedged-shape diamond stylus, since traditional adhesion test has the limitation that it is difficult to evaluate the adhesion of fine pattern coatings with a width less than several millimeters.
During the test, either a constant or progressive force normal to the surface is applied to the stylus. This yields adhesive and/or cohesive failures of the pattern coating-substrate system.
This test method is suitable for evaluating fine copper circuits up to a width of tens of micrometers and might also be suitable for evaluating fine patterns of other widths and materials. This international standard is intended for use in the macro (0,1 N to 30 N) force range. This procedure may also be applicable to other force ranges. However, appropriate calibration is required to quantify the normal forces at which failures occur.
