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<p>ISO/TS 10303-1623:2006 specifies the application module for
AP210 laminate assembly design.
</p>
<p>
ISO/TS 10303-1623:2006 deals with the
representation of laminate assembly design.
This data provides information sufficient to allow communication of the relative vertical arrangement
of laminates in an interconnect product, and required interconnections among the
materials assembled. Vertical assembly structure that varies over the x y plane of the substrate is supported. The geometric
pattern design details to be applied to a laminate are not covered in ISO/TS 10303-1623:2006.
Configuration management information and design change management information
is provided. ISO/TS 10303-1623:2006 does not provide for the description of the cloth that forms many dielectric materials used in laminates.
</p>
<p>The following are within the scope of
ISO/TS 10303-1623:2006:</p>
<ul><li>sequence of application of an embedded component;</li><li>sequence of material buildup or lamination;</li><li>support for embedded component location;</li><li>laminate terminals;</li><li>configuration management data;</li><li>design change management data.</li></ul>
Reģistrācijas numurs (WIID)
42402
Darbības sfēra
<p>ISO/TS 10303-1623:2006 specifies the application module for
AP210 laminate assembly design.
</p>
<p>
ISO/TS 10303-1623:2006 deals with the
representation of laminate assembly design.
This data provides information sufficient to allow communication of the relative vertical arrangement
of laminates in an interconnect product, and required interconnections among the
materials assembled. Vertical assembly structure that varies over the x y plane of the substrate is supported. The geometric
pattern design details to be applied to a laminate are not covered in ISO/TS 10303-1623:2006.
Configuration management information and design change management information
is provided. ISO/TS 10303-1623:2006 does not provide for the description of the cloth that forms many dielectric materials used in laminates.
</p>
<p>The following are within the scope of
ISO/TS 10303-1623:2006:</p>
<ul><li>sequence of application of an embedded component;</li><li>sequence of material buildup or lamination;</li><li>support for embedded component location;</li><li>laminate terminals;</li><li>configuration management data;</li><li>design change management data.</li></ul>
