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<p>ISO/TS 10303-1649:2006 specifies the application module for
Assembly technology.
</p>
<p>
ISO/TS 10303-1649:2006 deals with the
representation of the information needed to describe the different aspects of how components are joined together to make an
assembly.
ISO/TS 10303-1649:2006 defines the information needed to describe the material used in making the physical connections and their typical
shape.
ISO/TS 10303-1649:2006 is foundational for verification and validation that the actual design meets detailed functional specifications
by
providing a mechanism for a design organization to make explicit assertions about the detailed joints that are implemented
in the physical design.
</p>
<p>
The following are within the scope of
ISO/TS 10303-1649:2006:
</p>
<ul><li>bonds between components in an assembly;</li><li>bond shape definition;</li><li>bonds based on solder or adhesive;</li><li>bonds based on discrete fasteners;</li><li>component mating conditions characterization.</li></ul>
Reģistrācijas numurs (WIID)
42429
Darbības sfēra
<p>ISO/TS 10303-1649:2006 specifies the application module for
Assembly technology.
</p>
<p>
ISO/TS 10303-1649:2006 deals with the
representation of the information needed to describe the different aspects of how components are joined together to make an
assembly.
ISO/TS 10303-1649:2006 defines the information needed to describe the material used in making the physical connections and their typical
shape.
ISO/TS 10303-1649:2006 is foundational for verification and validation that the actual design meets detailed functional specifications
by
providing a mechanism for a design organization to make explicit assertions about the detailed joints that are implemented
in the physical design.
</p>
<p>
The following are within the scope of
ISO/TS 10303-1649:2006:
</p>
<ul><li>bonds between components in an assembly;</li><li>bond shape definition;</li><li>bonds based on solder or adhesive;</li><li>bonds based on discrete fasteners;</li><li>component mating conditions characterization.</li></ul>