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<p>ISO/TS 10303-1685:2006 specifies the application module for
Interconnect module to assembly module relationship.
</p>
<p>
The following are within the scope of
ISO/TS 10303-1685:2006:
</p>
<ul><li>assembly requirement for interconnect substrate;</li><li>assembly component based symbol placement in substrate requirement;</li><li>assembly component based annotation text placement in substrate requirement;</li><li>assembly component feature to layout feature requirement relationship;</li><li>external references for assembly component;</li><li>external references for assembly component feature;</li></ul>
Reģistrācijas numurs (WIID)
42553
Darbības sfēra
<p>ISO/TS 10303-1685:2006 specifies the application module for
Interconnect module to assembly module relationship.
</p>
<p>
The following are within the scope of
ISO/TS 10303-1685:2006:
</p>
<ul><li>assembly requirement for interconnect substrate;</li><li>assembly component based symbol placement in substrate requirement;</li><li>assembly component based annotation text placement in substrate requirement;</li><li>assembly component feature to layout feature requirement relationship;</li><li>external references for assembly component;</li><li>external references for assembly component feature;</li></ul>
