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<p>ISO/TS 10303-1688:2006 specifies the application module for
Interconnect non planar shape.
</p>
<p>
The following are within the scope of
ISO/TS 10303-1688:2006:
</p>
<ul><li>three dimensional manifold surface representation of an interconnect substrate;</li><li>placement of footprint and other planar feature definitions in a three dimensional manifold surface representation
including changing the planar shape to a manifold shape.
</li></ul>
Reģistrācijas numurs (WIID)
42556
Darbības sfēra
<p>ISO/TS 10303-1688:2006 specifies the application module for
Interconnect non planar shape.
</p>
<p>
The following are within the scope of
ISO/TS 10303-1688:2006:
</p>
<ul><li>three dimensional manifold surface representation of an interconnect substrate;</li><li>placement of footprint and other planar feature definitions in a three dimensional manifold surface representation
including changing the planar shape to a manifold shape.
</li></ul>
