Projekta Nr.ISO/TS 10303-1741:2006
Nosaukums<p>ISO/TS 10303-1741:2006 specifies the application module for Sequential laminate assembly design. </p> <p> The following are within the scope of ISO/TS 10303-1741:2006: </p> <ul> <li>sequence of application of an embedded component;</li> <li>sequence of material buildup or lamination;</li> <li>support for embedded component location;</li> <li>items within the scope of application module Assembly module with interconnect component, ISO/TS 10303-1643;</li> <li>items within the scope of application module Layered interconnect module design, ISO/TS 10303-1698.</li> </ul>
Reģistrācijas numurs (WIID)42665
Darbības sfēra<p>ISO/TS 10303-1741:2006 specifies the application module for Sequential laminate assembly design. </p> <p> The following are within the scope of ISO/TS 10303-1741:2006: </p> <ul> <li>sequence of application of an embedded component;</li> <li>sequence of material buildup or lamination;</li> <li>support for embedded component location;</li> <li>items within the scope of application module Assembly module with interconnect component, ISO/TS 10303-1643;</li> <li>items within the scope of application module Layered interconnect module design, ISO/TS 10303-1698.</li> </ul>
StatussAtcelts
ICS grupa25.040.40