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<p>ISO/TS 10303-1754:2010-03 specifies the application module for
Via component.
</p>
<p>
The following are within the scope of
ISO/TS 10303-1754:2010-03:
</p>
<ul>
<li>blind vias, connections between multiple layers of the printed circuit assembly where only one end is exposed;</li>
<li>cylinder vias, where the cross-section shape is constant;</li>
<li>tapered vias, where the cross-section shape may vary as the vertical distance changes;</li>
<li>stacked vias, where multiple bind and buried vias share the same x y position;</li>
<li>filled vias, where material may be inserted into the via during realization processes, which are
within the scope of application module Layered interconnect module design, ISO/TS 10303-1698;
</li>
<li>buried vias, connections between multiple layers of the printed circuit assembly where neither end is exposed;</li>
<li>interfacial connections, also known as through hole vias, which have both ends exposed;</li>
<li>items within the scope of application module Interconnect module connection routing, ISO/TS 10303-1684;</li>
<li>items within the scope of application module Layered interconnect module design, ISO/TS 10303-1698.</li>
</ul>
Reģistrācijas numurs (WIID)
56419
Darbības sfēra
<p>ISO/TS 10303-1754:2010-03 specifies the application module for
Via component.
</p>
<p>
The following are within the scope of
ISO/TS 10303-1754:2010-03:
</p>
<ul>
<li>blind vias, connections between multiple layers of the printed circuit assembly where only one end is exposed;</li>
<li>cylinder vias, where the cross-section shape is constant;</li>
<li>tapered vias, where the cross-section shape may vary as the vertical distance changes;</li>
<li>stacked vias, where multiple bind and buried vias share the same x y position;</li>
<li>filled vias, where material may be inserted into the via during realization processes, which are
within the scope of application module Layered interconnect module design, ISO/TS 10303-1698;
</li>
<li>buried vias, connections between multiple layers of the printed circuit assembly where neither end is exposed;</li>
<li>interfacial connections, also known as through hole vias, which have both ends exposed;</li>
<li>items within the scope of application module Interconnect module connection routing, ISO/TS 10303-1684;</li>
<li>items within the scope of application module Layered interconnect module design, ISO/TS 10303-1698.</li>
</ul>
