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<p>ISO/TS 10303-1689:2010-07 specifies the application module for
Interconnect physical requirement allocation.
</p>
<p>
The following are within the scope of
ISO/TS 10303-1689:2010-07:
</p>
<ul><li>thermal isolation requirement definition;</li><li>electrical isolation requirement definition;</li><li>thermal isolation template for substrate design;</li><li>electrical isolation template for substrate design;</li><li>length tolerance on spacing requirement;</li><li>allocation of an isolation requirement to a shield realized as part of an interconnect substrate.</li></ul>
Reģistrācijas numurs (WIID)
56974
Darbības sfēra
<p>ISO/TS 10303-1689:2010-07 specifies the application module for
Interconnect physical requirement allocation.
</p>
<p>
The following are within the scope of
ISO/TS 10303-1689:2010-07:
</p>
<ul><li>thermal isolation requirement definition;</li><li>electrical isolation requirement definition;</li><li>thermal isolation template for substrate design;</li><li>electrical isolation template for substrate design;</li><li>length tolerance on spacing requirement;</li><li>allocation of an isolation requirement to a shield realized as part of an interconnect substrate.</li></ul>
