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<p>ISO/TS 10303-1741:2018-11 specifies the application module for
Sequential laminate assembly design.
</p>
<p>
The following are within the scope of
ISO/TS 10303-1741:2018-11:
</p>
<ul>
<li>sequence of application of an embedded component;</li>
<li>sequence of material buildup or lamination;</li>
<li>support for embedded component location;</li>
<li>items within the scope of application module Layered interconnect module design, ISO/TS 10303-1698.</li>
</ul>
Reģistrācijas numurs (WIID)
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Darbības sfēra
<p>ISO/TS 10303-1741:2018-11 specifies the application module for
Sequential laminate assembly design.
</p>
<p>
The following are within the scope of
ISO/TS 10303-1741:2018-11:
</p>
<ul>
<li>sequence of application of an embedded component;</li>
<li>sequence of material buildup or lamination;</li>
<li>support for embedded component location;</li>
<li>items within the scope of application module Layered interconnect module design, ISO/TS 10303-1698.</li>
</ul>
