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<p>ISO/TS 10303-1716:2018-11 specifies the application module for
Layered interconnect complex template.
</p>
<p>
The following are within the scope of
ISO/TS 10303-1716:2018-11:
</p>
<ul>
<li>footprint definition;</li>
<li>footprint definition shape;</li>
<li>padstack definition;</li>
<li>padstack definition shape;</li>
<li>items within the scope of application module Layered interconnect simple template, ISO/TS 10303-1718;</li>
<li>items within the scope of application module Physical unit 2d shape, ISO/TS 10303-1726.</li>
</ul>
Reģistrācijas numurs (WIID)
76263
Darbības sfēra
<p>ISO/TS 10303-1716:2018-11 specifies the application module for
Layered interconnect complex template.
</p>
<p>
The following are within the scope of
ISO/TS 10303-1716:2018-11:
</p>
<ul>
<li>footprint definition;</li>
<li>footprint definition shape;</li>
<li>padstack definition;</li>
<li>padstack definition shape;</li>
<li>items within the scope of application module Layered interconnect simple template, ISO/TS 10303-1718;</li>
<li>items within the scope of application module Physical unit 2d shape, ISO/TS 10303-1726.</li>
</ul>
