Projekta Nr.ISO/TS 10303-1700:2018
Nosaukums<p>ISO/TS 10303-1700:2018-11 specifies the application module for Layered interconnect module with printed component design. </p> <p> The following are within the scope of ISO/TS 10303-1700:2018-11: </p> <ul> <li>printed components;</li> <li>routed printed components;</li> <li>printed connectors;</li> <li>items within the scope of application module Land, ISO/TS 10303-1692;</li> <li>items within the scope of application module Printed physical layout template, ISO/TS 10303-1737.</li> </ul>
Reģistrācijas numurs (WIID)76250
Darbības sfēra<p>ISO/TS 10303-1700:2018-11 specifies the application module for Layered interconnect module with printed component design. </p> <p> The following are within the scope of ISO/TS 10303-1700:2018-11: </p> <ul> <li>printed components;</li> <li>routed printed components;</li> <li>printed connectors;</li> <li>items within the scope of application module Land, ISO/TS 10303-1692;</li> <li>items within the scope of application module Printed physical layout template, ISO/TS 10303-1737.</li> </ul>
StatussStandarts spēkā
ICS grupa25.040.40