Projekta Nr.ISO/TS 10303-1682:2018
Nosaukums<p>ISO/TS 10303-1682:2018-11 specifies the application module for Interconnect 2D shape. </p> <p> The following are within the scope of ISO/TS 10303-1682:2018-11: </p> <ul><li>embedded physical component location;</li><li>continuous planar feature shape definition.</li></ul>
Reģistrācijas numurs (WIID)76234
Darbības sfēra<p>ISO/TS 10303-1682:2018-11 specifies the application module for Interconnect 2D shape. </p> <p> The following are within the scope of ISO/TS 10303-1682:2018-11: </p> <ul><li>embedded physical component location;</li><li>continuous planar feature shape definition.</li></ul>
StatussStandarts spēkā
ICS grupa25.040.40