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<p>ISO/TS 10303-1650:2018-11 specifies the application module for
Bare die.
</p>
<p>
The following is within the scope of
ISO/TS 10303-1650:2018-11:
</p>
<p style="padding-left: 40px;">
The
representation of the information needed to describe a semiconductor material product
that is an integrated circuit component, or that may be a discrete active component,
or that may be included as a component in an electronic assembly.
Terminal information is supported, including explicit shape data.
A bare die usually refers to semiconductor substrates that are traditionally considered protected by a container, called
a package.
</p><ul><li>definition of the minimum content model of an interface control definition of a bare die, including its terminals, behavioural
simulation model, and shape.
</li></ul>
Reģistrācijas numurs (WIID)
76219
Darbības sfēra
<p>ISO/TS 10303-1650:2018-11 specifies the application module for
Bare die.
</p>
<p>
The following is within the scope of
ISO/TS 10303-1650:2018-11:
</p>
<p style="padding-left: 40px;">
The
representation of the information needed to describe a semiconductor material product
that is an integrated circuit component, or that may be a discrete active component,
or that may be included as a component in an electronic assembly.
Terminal information is supported, including explicit shape data.
A bare die usually refers to semiconductor substrates that are traditionally considered protected by a container, called
a package.
</p><ul><li>definition of the minimum content model of an interface control definition of a bare die, including its terminals, behavioural
simulation model, and shape.
</li></ul>
