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<p>ISO/TS 10303-1649:2019 specifies the application module for
Assembly technology.
</p>
<p>
The following are within the scope of
ISO/TS 10303-1649:2019:
</p>
<p style="padding-left: 40px;">
the
representation of the information needed to describe the different aspects of how components are joined together to make an
assembly.
This module defines the information needed to describe the material used in making the physical connections and their typical
shape.
This module is foundational for verification and validation that the actual design meets detailed functional specifications
by
providing a mechanism for a design organization to make explicit assertions about the detailed joints that are implemented
in the physical design.
</p><ul><li>bonds between components in an assembly;</li><li>bond shape definition;</li><li>bonds based on solder or adhesive;</li><li>bonds based on discrete fasteners;</li><li>component mating conditions characterization.</li></ul>
Reģistrācijas numurs (WIID)
78651
Darbības sfēra
<p>ISO/TS 10303-1649:2019 specifies the application module for
Assembly technology.
</p>
<p>
The following are within the scope of
ISO/TS 10303-1649:2019:
</p>
<p style="padding-left: 40px;">
the
representation of the information needed to describe the different aspects of how components are joined together to make an
assembly.
This module defines the information needed to describe the material used in making the physical connections and their typical
shape.
This module is foundational for verification and validation that the actual design meets detailed functional specifications
by
providing a mechanism for a design organization to make explicit assertions about the detailed joints that are implemented
in the physical design.
</p><ul><li>bonds between components in an assembly;</li><li>bond shape definition;</li><li>bonds based on solder or adhesive;</li><li>bonds based on discrete fasteners;</li><li>component mating conditions characterization.</li></ul>
