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<p>ISO/TS 10303-1647:2019 specifies the application module for
Assembly physical interface requirement.
</p>
<p>
The following are within the scope of
ISO/TS 10303-1647:2019:
</p>
<p style="padding-left: 40px;">
the representation of the information needed to describe the manner by which an electronic assembly shall mechanically
interface to the next higher assembly. The type of mating connector and its location relative to the electronic assembly are
provided as a design requirement, that must be satisfied in the design.
The module includes representation of the information needed to describe a physical layer of a communication protocol at
a connector interface level.
</p><ul><li>mating connector location;</li><li>design volume description;</li><li>physical protocol layer description including connector pinout mapping to signal names;</li></ul>
Reģistrācijas numurs (WIID)
78650
Darbības sfēra
<p>ISO/TS 10303-1647:2019 specifies the application module for
Assembly physical interface requirement.
</p>
<p>
The following are within the scope of
ISO/TS 10303-1647:2019:
</p>
<p style="padding-left: 40px;">
the representation of the information needed to describe the manner by which an electronic assembly shall mechanically
interface to the next higher assembly. The type of mating connector and its location relative to the electronic assembly are
provided as a design requirement, that must be satisfied in the design.
The module includes representation of the information needed to describe a physical layer of a communication protocol at
a connector interface level.
</p><ul><li>mating connector location;</li><li>design volume description;</li><li>physical protocol layer description including connector pinout mapping to signal names;</li></ul>
