CLC/SR 91
| Reģistrācijas numurs (WIID) | Projekta Nr. | Nosaukums | Statuss |
|---|---|---|---|
| 81294 | prEN IEC 61249-2-55 | Materials for printed boards and other interconnecting structures - Part 2-55: Reinforced base materials clad and unclad - Non-halogenated modified or unmodified resin system, woven e-glass laminate sheets of defined dissipation factor (less than 0,005 at 10 GHz) and flammability (vertical burning test), copper-clad for high speed applications | Izstrādē |
| 78662 | prEN IEC 61249-3-6:2025 | Matériaux pour circuits imprimés et autres structures d’interconnexion - Partie 3-6: Collection de spécifications intermédiaires pour matériaux de base non renforcés, métallisés et non métallisés - Feuilles stratifiées en PTFE avec charges d’inflammabilité définie (essai de combustion verticale), plaquées cuivre | Aptauja slēgta |
| 77836 | prEN IEC 61760-1:2025 | Technique du montage en surface - Partie 1: Méthode normalisée pour la spécification des composants pour montage en surface (CMS) | Izstrādē |
| 79818 | prEN IEC 61760-4:2025 | Surface mounting technology - Part 4: Classification, packaging, labelling and handling of moisture sensitive devices | Aptauja |
| 81499 | prEN IEC 62878-2-604 | Device embedding assembly technology - Part 2-604: Guideline for stacked electronic module - Evaluation method of heat transfer for stacked electronic module | Izstrādē |
| 74330 | prEN IEC 63215-1 | Endurance test methods for die attach materials - Part 1: General specification | Izstrādē |
| 75074 | prEN IEC 63215-3 | Endurance test methods for die attach materials - Part 3: Power cycling test method for die attach materials applied to discrete type power electronic devices | Izstrādē |
| 74461 | prEN IEC 63215-4 | Endurance test methods for die attach materials - Part 4: Power cycling test method for die attach materials (near chip interconnection) applied to module type power electronic devices | Izstrādē |
| 75075 | prEN IEC 63215-5:2022 | Endurance test methods for die attach materials - Part 5: Temperature cycling test methods for die attach materials (system soldering interconnection) applied to module type power electronic devices | Aptauja slēgta |
| 78761 | prEN IEC 63516:2025 | Fixed folding durability test method for flexible opto-electric circuit boards | Aptauja |
Attēlo no 761. līdz 770. no pavisam 774 ieraksta(-iem).