CLC/SR 91
| Reģistrācijas numurs (WIID) | Projekta Nr. | Nosaukums | Statuss |
|---|---|---|---|
| 79810 | prEN IEC 63569:2025 | High-level test description table for development of production test programs | Aptauja |
| 80939 | prEN IEC 63609-1 | Measurement method used in thermal design for electronics assemblies - Part 1: Measurement requirements used in thermal design for the circuit boards or assemblies with miniaturized smds where the heat dissipation path to the board is dominant | Izstrādē |
| 80940 | prEN IEC 63609-2 | Measurement method used in thermal design for electronics assemblies - Part 2: Measurement method for thermal conductivity of circuit boards with polymer composites | Izstrādē |
| 81010 | prEN IEC 63609-3 | Measurement method used in thermal design for electronics assemblies - Part 3: Temperature measurement method for miniaturized smds on circuit boards | Izstrādē |
Attēlo no 771. līdz 774. no pavisam 774 ieraksta(-iem).