Reģistrācijas numurs (WIID)Projekta Nr.NosaukumsStatuss
74330prEN IEC 63215-1Endurance test methods for die attach materials - Part 1: General specificationIzstrādē
75074prEN IEC 63215-3Endurance test methods for die attach materials - Part 3: Power cycling test method for die attach materials applied to discrete type power electronic devicesIzstrādē
74461prEN IEC 63215-4Endurance test methods for die attach materials - Part 4: Power cycling test method for die attach materials (near chip interconnection) applied to module type power electronic devicesIzstrādē
75075prEN IEC 63215-5:2022Endurance test methods for die attach materials - Part 5: Temperature cycling test methods for die attach materials (system soldering interconnection) applied to module type power electronic devicesAptauja slēgta
78761prEN IEC 63516:2025Prüfverfahren für Beständigkeit gegenüber Faltung für flexible opto-elektrische LeiterplattenAptauja slēgta
79810prEN IEC 63569:2025Hochrangige Testbeschreibungstabelle für die Entwicklung von ProduktionstestprogrammenAptauja slēgta
80939prEN IEC 63609-1Thermal design of electronics assemblies with miniaturised surface mounting devices and related measurements - Part 1: Guideline for thermal design of applications where the heat dissipation path to the board is dominantIzstrādē
80940prEN IEC 63609-2Thermal design of electronics assemblies with miniaturised surface mounting devices and related measurements - Part 2: Method for evaluating thermal conductivity of circuit boards with polymer composites by using finite element analysis and measurementsIzstrādē
81010prEN IEC 63609-3Thermal design of electronics assemblies with miniaturised surface mounting devices and related measurements - Part 3: Determination for temperature measurement in miniaturised surface mounting devices using thermocouplesIzstrādē
Attēlo no 771. līdz 779. no pavisam 779 ieraksta(-iem).