CLC/SR 91
| Reģistrācijas numurs (WIID) | Projekta Nr. | Nosaukums | Statuss |
|---|---|---|---|
| 77883 | FprEN IEC 60068-2-88:2025 | Essais d’environnement - Partie 2-88: Essais - Essai xd: Résistance des composants et des assemblages aux produits de nettoyage liquides | Izstrādē |
| 81294 | prEN IEC 61249-2-55 | Materials for printed boards and other interconnecting structures - Part 2-55: Reinforced base materials clad and unclad - Non-halogenated modified or unmodified resin system, woven e-glass laminate sheets of defined dissipation factor (less than 0,005 at 10 GHz) and flammability (vertical burning test), copper-clad for high speed applications | Izstrādē |
| 71079 | EN IEC 61760-2:2021 | Surface mounting technology - Part 2: Transportation and storage conditions of surface mounting devices (SMD) - Application guide | Izstrādē |
| 66142 | EN IEC 61189-2-630:2018 | Test methods for electrical materials, printed board and other interconnection structures and assemblies - Part 2-630: Test methods for materials for interconnection structures - Moisture absorption after pressure vessel conditioning | Izstrādē |
| 81232 | prEN IEC 61189-3-720 | Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 3-720: Test methods for interconnection structures (circuit boards) - Transmission loss test method for high frequency multilayer circuit boards | Izstrādē |
| 78781 | FprEN IEC 60068-2-83:2025 | Umweltprüfungen - Teil 2-83: Prüfungen - Prüfung tf: Prüfung der Lötbarkeit von elektronischen Bauelementen für oberflächenmontierbaren Bauelementen (SMD) nach dem Benetzungsbilanzverfahren unter Verwendung von Lotpaste | Izstrādē |
| 56341 | EN 61249-2-9:2003 | Materials for printed boards and other interconnecting structures - Part 2-9: Reinforced base materials, clad and unclad - Bismaleimide/triazine, modified epoxide or unmodified, woven E-glass reinforced laminated sheets of defined flammability (vertical burning test), copper-clad | Izstrādē |
| 48866 | EN 62326-1:2002 | Leiterplatten - Teil 1: Fachgrundspezifikation | Izstrādē |
| 66829 | EN 60068-2-69:2017/A1:2019 | Environmental testing - Part 2-69: Tests - Test Te/Tc: Solderability testing of electronic components and printed boards by the wetting balance (force measurement) method | Izstrādē |
| 45356 | prEN 123300 | Sectional Specification: Multilayer printed boards | Izstrādē |
Attēlo no 131. līdz 140. no pavisam 773 ieraksta(-iem).