Reģistrācijas numurs (WIID)Projekta Nr.NosaukumsStatuss
79818prEN IEC 61760-4Surface mounting technology - Part 4: Classification, packaging, labelling and handling of moisture sensitive devicesIzstrādē
77836prEN IEC 61760-1Technique du montage en surface - Partie 1: Méthode normalisée pour la spécification des composants montés en surface (CMS).Izstrādē
78662prEN IEC 61249-3-6:2025Matériaux pour circuits imprimés et autres structures d’interconnexion - Partie 3-6: Collection de spécifications intermédiaires pour matériaux de base non renforcés, métallisés et non métallisés - Feuilles stratifiées en PTFE avec charges d’inflammabilité définie (essai de combustion verticale), plaquées cuivreAptauja
81294prEN IEC 61249-2-55Materials for printed boards and other interconnecting structures - Part 2-55: Reinforced base materials clad and unclad - Non-halogenated modified or unmodified resin system, woven e-glass laminate sheets of defined dissipation factor (less than 0,005 at 10 GHz) and flammability (vertical burning test), copper-clad for high speed applicationsIzstrādē
80138prEN IEC 61249-2-54Materials for printed boards and other interconnecting structures - Part 2-54: Reinforced base materials clad and unclad - Halogenated modified or unmodified resin system, woven e-glass laminate sheets of defined dissipation factor (less than 0,005 at 10 GHz) and flammability (vertical burning test), copper-clad for high speed applicationsIzstrādē
78760prEN IEC 61249-2-53:2024Werkstoffe für Leiterplatten und andere Verbindungsstrukturen - Teil 2-53: Kaschierte und unkaschierte verstärkte Basismaterialien - ungefüllte PTFE-Laminattafeln mit definierter Brennbarkeit (Brennprüfung mit vertikaler Prüflingslage), kupferkaschiertAptauja slēgta
77148prEN IEC 61249-2-52:2024Materials for printed boards and other interconnecting structures - Part 2-52: Reinforced base materials clad and unclad - Thermosetting hydrocarbon resin system, woven e-glass reinforced laminate sheets of defined flammability (vertical burning test), copper-cladAptauja slēgta
81226prEN IEC 61190-1-3Attachment materials for electronic assembly - Part 1-3: Requirements for electronic grade solder alloys and fluxed and non-fluxed solid solder for electronic soldering applicationsIzstrādē
81235prEN IEC 61189-5-501Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-501: General test methods for materials and assemblies - Surface insulation resistance (SIR) testing of solder fluxesIzstrādē
81232prEN IEC 61189-3-720Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 3-720: Test methods for interconnection structures (circuit boards) - Transmission loss test method for high frequency multilayer circuit boardsIzstrādē
Attēlo no 11. līdz 20. no pavisam 773 ieraksta(-iem).