CLC/SR 91
Reģistrācijas numurs (WIID) | Projekta Nr. | Nosaukums | Statuss |
---|---|---|---|
81010 | prEN IEC 63609-3 | Measurement method used in thermal design for electronics assemblies - Part 3: Temperature measurement method for miniaturized smds on circuit boards | Izstrādē |
80940 | prEN IEC 63609-2 | Measurement method used in thermal design for electronics assemblies - Part 2: Measurement method for thermal conductivity of circuit boards with polymer composites | Izstrādē |
80939 | prEN IEC 63609-1 | Measurement method used in thermal design for electronics assemblies - Part 1: Measurement requirements used in thermal design for the circuit boards or assemblies with miniaturized smds where the heat dissipation path to the board is dominant | Izstrādē |
79810 | prEN IEC 63569 | High-level test description table for development of production test programs | Izstrādē |
78761 | prEN IEC 63516 | Fixed folding durability test method for flexible opto-electric circuit boards | Izstrādē |
75075 | prEN IEC 63215-5:2022 | Endurance test methods for die attach materials - Part 5: Temperature cycling test methods for die attach materials (system soldering interconnection) applied to module type power electronic devices | Aptauja slēgta |
74461 | prEN IEC 63215-4 | Endurance test methods for die attach materials - Part 4: Power cycling test method for die attach materials (near chip interconnection) applied to module type power electronic devices | Izstrādē |
75074 | prEN IEC 63215-3 | Endurance test methods for die attach materials - Part 3: Power cycling test method for die attach materials applied to discrete type power electronic devices | Izstrādē |
74330 | prEN IEC 63215-1 | Endurance test methods for die attach materials - Part 1: General specification | Izstrādē |
81499 | prEN IEC 62878-2-604 | Device embedding assembly technology - Part 2-604: Guideline for stacked electronic module - Evaluation method of heat transfer for stacked electronic module | Izstrādē |
Attēlo no 1. līdz 10. no pavisam 773 ieraksta(-iem).