CLC/SR 91
| Reģistrācijas numurs (WIID) | Projekta Nr. | Nosaukums | Statuss |
|---|---|---|---|
| 81010 | prEN IEC 63609-3 | Thermal design of electronics assemblies with miniaturised surface mounting devices and related measurements - Part 3: Determination for temperature measurement in miniaturised surface mounting devices using thermocouples | Izstrādē |
| 80940 | prEN IEC 63609-2 | Thermal design of electronics assemblies with miniaturised surface mounting devices and related measurements - Part 2: Method for evaluating thermal conductivity of circuit boards with polymer composites by using finite element analysis and measurements | Izstrādē |
| 80939 | prEN IEC 63609-1 | Thermal design of electronics assemblies with miniaturised surface mounting devices and related measurements - Part 1: Guideline for thermal design of applications where the heat dissipation path to the board is dominant | Izstrādē |
| 79810 | prEN IEC 63569:2025 | Hochrangige Testbeschreibungstabelle für die Entwicklung von Produktionstestprogrammen | Aptauja slēgta |
| 78761 | prEN IEC 63516:2025 | Prüfverfahren für Beständigkeit gegenüber Faltung für flexible opto-elektrische Leiterplatten | Aptauja slēgta |
| 75075 | prEN IEC 63215-5:2022 | Endurance test methods for die attach materials - Part 5: Temperature cycling test methods for die attach materials (system soldering interconnection) applied to module type power electronic devices | Aptauja slēgta |
| 74461 | prEN IEC 63215-4 | Endurance test methods for die attach materials - Part 4: Power cycling test method for die attach materials (near chip interconnection) applied to module type power electronic devices | Izstrādē |
| 75074 | prEN IEC 63215-3 | Endurance test methods for die attach materials - Part 3: Power cycling test method for die attach materials applied to discrete type power electronic devices | Izstrādē |
| 74330 | prEN IEC 63215-1 | Endurance test methods for die attach materials - Part 1: General specification | Izstrādē |
| 81499 | prEN IEC 62878-2-604 | Device embedding assembly technology - Part 2-604: Guideline for stacked electronic module - Evaluation method of heat transfer for stacked electronic module | Izstrādē |
Attēlo no 1. līdz 10. no pavisam 779 ieraksta(-iem).