Reģistrācijas numurs (WIID)Projekta Nr.NosaukumsStatuss
81010prEN IEC 63609-3Measurement method used in thermal design for electronics assemblies - Part 3: Temperature measurement method for miniaturized smds on circuit boardsIzstrādē
80940prEN IEC 63609-2Measurement method used in thermal design for electronics assemblies - Part 2: Measurement method for thermal conductivity of circuit boards with polymer compositesIzstrādē
80939prEN IEC 63609-1Measurement method used in thermal design for electronics assemblies - Part 1: Measurement requirements used in thermal design for the circuit boards or assemblies with miniaturized smds where the heat dissipation path to the board is dominantIzstrādē
79810prEN IEC 63569High-level test description table for development of production test programsIzstrādē
78761prEN IEC 63516Fixed folding durability test method for flexible opto-electric circuit boardsIzstrādē
75075prEN IEC 63215-5:2022Endurance test methods for die attach materials - Part 5: Temperature cycling test methods for die attach materials (system soldering interconnection) applied to module type power electronic devicesAptauja slēgta
74461prEN IEC 63215-4Endurance test methods for die attach materials - Part 4: Power cycling test method for die attach materials (near chip interconnection) applied to module type power electronic devicesIzstrādē
75074prEN IEC 63215-3Endurance test methods for die attach materials - Part 3: Power cycling test method for die attach materials applied to discrete type power electronic devicesIzstrādē
74330prEN IEC 63215-1Endurance test methods for die attach materials - Part 1: General specificationIzstrādē
81499prEN IEC 62878-2-604Device embedding assembly technology - Part 2-604: Guideline for stacked electronic module - Evaluation method of heat transfer for stacked electronic moduleIzstrādē
Attēlo no 1. līdz 10. no pavisam 773 ieraksta(-iem).