Reģistrācijas numurs (WIID)Projekta Nr.NosaukumsStatuss
79949prEN IEC 61189-3-303Test methods for electrical materials, printed board and other interconnection structures and assemblies - Part 3-303: Test methods for interconnection structures (circuit boards) - Etch factor measurement for traces on circuit boardsIzstrādē
78668prEN IEC 61189-3-302:2024Prüfverfahren für Elektromaterialien, Leiterplatten und andere Verbindungsstrukturen und Baugruppen – Teil 3-302: Computertomographisches Verfahren (CT) zur Detektion von Metallisierungsfehlern in unbestückten LeiterplattenAptauja slēgta
54889prEN 62468The marking for the presence and absence of the specified chemical substances in materials, components and mounted boards used in electrical and electronic equipmentIzstrādē
51122prEN 62326-3Printed boards - Part 3: Safety certification of rigid printed circuit boards for use in electronic assemblies (performance for capability approval)Izstrādē
43627prEN 61249-4-1Matériaux pour circuits imprimés et autres structures d'interconnexion - Partie 4: Série de spécifications intermédiaires pour matériaux pré-imprégnés, non plaqués (pour la fabrication des cartes multicouche) - Section 1: Matériau préimprégné en tissu de verre de type E époxyde d'inflammabilité définie (essai de combustion verticale)Izstrādē
46269prEN 60249-3-3Base materials for printed circuits - Part 3: Special materials used in connection with printed circuits - Specification No. 3: Permanent polymer coating materials (solder resist) for use in the fabrication of printed boardsIzstrādē
41974prEN 50XXXRevision of BS 6221-21:1984 - Printed boards - Part 21: Guide for the rework of printed boardsIzstrādē
50225prEN 50XXXDraft BS 6221-25: Printed wiring boards - Part 25: Guidelines for the rework and repair of soldered surface mounted printed board assembliesIzstrādē
49401prEN 50XXXBS 6096 - Marking inks and solder-resist coating materials for printed circuitsIzstrādē
55996prEN 50XXXBS 6221 - Printed wiring boards - Part 3: Guide for the design and use of printed wiring boards - Revision clause 8.2: Flatness of electronic assembliesIzstrādē
Attēlo no 21. līdz 30. no pavisam 773 ieraksta(-iem).