CLC/SR 91
| Reģistrācijas numurs (WIID) | Projekta Nr. | Nosaukums | Statuss |
|---|---|---|---|
| 54889 | prEN 62468 | The marking for the presence and absence of the specified chemical substances in materials, components and mounted boards used in electrical and electronic equipment | Izstrādē |
| 51122 | prEN 62326-3 | Printed boards - Part 3: Safety certification of rigid printed circuit boards for use in electronic assemblies (performance for capability approval) | Izstrādē |
| 43627 | prEN 61249-4-1 | Matériaux pour circuits imprimés et autres structures d'interconnexion - Partie 4: Série de spécifications intermédiaires pour matériaux pré-imprégnés, non plaqués (pour la fabrication des cartes multicouche) - Section 1: Matériau préimprégné en tissu de verre de type E époxyde d'inflammabilité définie (essai de combustion verticale) | Izstrādē |
| 46269 | prEN 60249-3-3 | Base materials for printed circuits - Part 3: Special materials used in connection with printed circuits - Specification No. 3: Permanent polymer coating materials (solder resist) for use in the fabrication of printed boards | Izstrādē |
| 50225 | prEN 50XXX | Draft BS 6221-25: Printed wiring boards - Part 25: Guidelines for the rework and repair of soldered surface mounted printed board assemblies | Izstrādē |
| 49401 | prEN 50XXX | BS 6096 - Marking inks and solder-resist coating materials for printed circuits | Izstrādē |
| 41974 | prEN 50XXX | Revision of BS 6221-21:1984 - Printed boards - Part 21: Guide for the rework of printed boards | Izstrādē |
| 55996 | prEN 50XXX | BS 6221 - Printed wiring boards - Part 3: Guide for the design and use of printed wiring boards - Revision clause 8.2: Flatness of electronic assemblies | Izstrādē |
| 45356 | prEN 123300 | Sectional Specification: Multilayer printed boards | Izstrādē |
| 53624 | prEN 123200 | Sectional Specification: Single- and double-sided printed boards with plated-through holes | Izstrādē |
Attēlo no 21. līdz 30. no pavisam 779 ieraksta(-iem).