CLC/SR 91
| Reģistrācijas numurs (WIID) | Projekta Nr. | Nosaukums | Statuss |
|---|---|---|---|
| 81294 | prEN IEC 61249-2-55 | Materials for printed boards and other interconnecting structures - Part 2-55: Reinforced base materials clad and unclad - Non-halogenated modified or unmodified resin system, woven e-glass laminate sheets of defined dissipation factor (less than 0,005 at 10 GHz) and flammability (vertical burning test), copper-clad for high speed applications | Izstrādē |
| 81235 | prEN IEC 61189-5-501 | Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-501: General test methods for materials and assemblies - Surface insulation resistance (SIR) testing of solder fluxes | Izstrādē |
| 81499 | prEN IEC 62878-2-604 | Device embedding assembly technology - Part 2-604: Guideline for stacked electronic module - Evaluation method of heat transfer for stacked electronic module | Izstrādē |
| 81010 | prEN IEC 63609-3 | Thermal design of electronics assemblies with miniaturised surface mounting devices and related measurements - Part 3: Determination for temperature measurement in miniaturised surface mounting devices using thermocouples | Izstrādē |
| 66546 | EN 60068-2-69:2017/AC:2018-03 | Umgebungseinflüsse - Teil 2-69: Prüfungen - Prüfung Te/TC: Prüfung der Lötbarkeit von Bauelementen der Elektronik und Leiterplatten mit der Benetzungswaage (Kraftmessung) | Izstrādē |
| 80940 | prEN IEC 63609-2 | Thermal design of electronics assemblies with miniaturised surface mounting devices and related measurements - Part 2: Method for evaluating thermal conductivity of circuit boards with polymer composites by using finite element analysis and measurements | Izstrādē |
| 80939 | prEN IEC 63609-1 | Thermal design of electronics assemblies with miniaturised surface mounting devices and related measurements - Part 1: Guideline for thermal design of applications where the heat dissipation path to the board is dominant | Izstrādē |
| 71079 | EN IEC 61760-2:2021 | Surface mounting technology - Part 2: Transportation and storage conditions of surface mounting devices (SMD) - Application guide | Izstrādē |
| 54038 | EN 61249-4-1:2008 | Materialien für Leiterplatten und andere Verbindungsstrukturen - Teil 4-1: Rahmenspezifikationen für unkaschierte Prepreg-Materialien (zur Herstellung von Mehrlagenleiterplatten) - Mit E-Glasgewebe verstärkte Epoxidharz-Prepregs mit definierter Brennbarkeit | Izstrādē |
| 68537 | EN IEC 61249-6-3:2023 | Materialien für Leiterplatten und andere Verbindungsstrukturen - Teil 6-3: Rahmenspezifikationen für Verstärkungsmaterialien - Spezifikation für mit Haftvermittler ausgerüstete Gewebe aus E-Glasfaser-Garnen für Leiterplatten | Izstrādē |
Attēlo no 31. līdz 40. no pavisam 779 ieraksta(-iem).