CLC/SR 91
| Reģistrācijas numurs (WIID) | Projekta Nr. | Nosaukums | Statuss |
|---|---|---|---|
| 81235 | prEN IEC 61189-5-501 | Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-501: General test methods for materials and assemblies - Surface insulation resistance (SIR) testing of solder fluxes | Izstrādē |
| 81294 | prEN IEC 61249-2-55 | Materials for printed boards and other interconnecting structures - Part 2-55: Reinforced base materials clad and unclad - Non-halogenated modified or unmodified resin system, woven e-glass laminate sheets of defined dissipation factor (less than 0,005 at 10 GHz) and flammability (vertical burning test), copper-clad for high speed applications | Izstrādē |
| 81499 | prEN IEC 62878-2-604 | Device embedding assembly technology - Part 2-604: Guideline for stacked electronic module - Evaluation method of heat transfer for stacked electronic module | Izstrādē |
Attēlo no 771. līdz 773. no pavisam 773 ieraksta(-iem).