CLC/SR 91
| Reģistrācijas numurs (WIID) | Projekta Nr. | Nosaukums | Statuss |
|---|---|---|---|
| 81235 | prEN IEC 61189-5-501 | Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-501: General test methods for materials and assemblies - Surface insulation resistance (SIR) testing of solder fluxes | Izstrādē |
| 81232 | prEN IEC 61189-3-720 | Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 3-720: Test methods for interconnection structures (circuit boards) - Transmission loss test method for high frequency multilayer circuit boards | Izstrādē |
| 78781 | FprEN IEC 60068-2-83:2025 | Umweltprüfungen - Teil 2-83: Prüfungen - Prüfung tf: Prüfung der Lötbarkeit von elektronischen Bauelementen für oberflächenmontierbaren Bauelementen (SMD) nach dem Benetzungsbilanzverfahren unter Verwendung von Lotpaste | Izstrādē |
Attēlo no 771. līdz 773. no pavisam 773 ieraksta(-iem).