CLC/SR 91
| Reģistrācijas numurs (WIID) | Projekta Nr. | Nosaukums | Statuss |
|---|---|---|---|
| 81499 | prEN IEC 62878-2-604 | Device embedding assembly technology - Part 2-604: Guideline for stacked electronic module - Evaluation method of heat transfer for stacked electronic module | Izstrādē |
| 81294 | prEN IEC 61249-2-55 | Materials for printed boards and other interconnecting structures - Part 2-55: Reinforced base materials clad and unclad - Non-halogenated modified or unmodified resin system, woven e-glass laminate sheets of defined dissipation factor (less than 0,005 at 10 GHz) and flammability (vertical burning test), copper-clad for high speed applications | Izstrādē |
| 81235 | prEN IEC 61189-5-501 | Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-501: General test methods for materials and assemblies - Surface insulation resistance (SIR) testing of solder fluxes | Izstrādē |
| 81232 | prEN IEC 61189-3-720 | Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 3-720: Test methods for interconnection structures (circuit boards) - Transmission loss test method for high frequency multilayer circuit boards | Izstrādē |
| 81226 | prEN IEC 61190-1-3 | Attachment materials for electronic assembly - Part 1-3: Requirements for electronic grade solder alloys and fluxed and non-fluxed solid solder for electronic soldering applications | Izstrādē |
| 81010 | prEN IEC 63609-3 | Measurement method used in thermal design for electronics assemblies - Part 3: Temperature measurement method for miniaturized smds on circuit boards | Izstrādē |
| 80940 | prEN IEC 63609-2 | Measurement method used in thermal design for electronics assemblies - Part 2: Measurement method for thermal conductivity of circuit boards with polymer composites | Izstrādē |
| 80939 | prEN IEC 63609-1 | Measurement method used in thermal design for electronics assemblies - Part 1: Measurement requirements used in thermal design for the circuit boards or assemblies with miniaturized smds where the heat dissipation path to the board is dominant | Izstrādē |
| 80138 | prEN IEC 61249-2-54 | Materials for printed boards and other interconnecting structures - Part 2-54: Reinforced base materials clad and unclad - Halogenated modified or unmodified resin system, woven e-glass laminate sheets of defined dissipation factor (less than 0,005 at 10 GHz) and flammability (vertical burning test), copper-clad for high speed applications | Izstrādē |
| 79949 | prEN IEC 61189-3-303 | Test methods for electrical materials, printed board and other interconnection structures and assemblies - Part 3-303: Test methods for interconnection structures (circuit boards) - Etch factor measurement for traces on circuit boards | Izstrādē |
Attēlo no 1. līdz 10. no pavisam 773 ieraksta(-iem).